Overclock the Kurobox Pro/Linkstation Pro - Revision history

Lsuser1985: Remove category `Hacking`, add `Hardware`.

Lsuser1985 — Fri, 18 Jan 2013 15:43:09 GMT

Remove category `Hacking`, add `Hardware`.

← Older revision		Revision as of 15:43, 18 January 2013
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-	{{Articles\|KuroboxPro\|LSPro\|~~Hacking~~}}	+	{{Articles\|KuroboxPro\|LSPro\|Hardware}}
	=='''Disclaimer and Preface'''==		=='''Disclaimer and Preface'''==

Anhxco: /* Procedure */

Anhxco — Mon, 12 Sep 2011 14:45:39 GMT

Procedure

← Older revision		Revision as of 14:45, 12 September 2011
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	Install crystal oscillator module (item 1 in parts list) to X3 position.		Install crystal oscillator module (item 1 in parts list) to X3 position.

-	C221 does not exist in the motherboard position as shown in the original photo or article; you can ignore it for the moment. Will re-visit in step 5.	+	C221 does not exist in the motherboard position as shown in the original photo or article; you can ignore it for the moment. Will re-visit in step 3.

	Move resistor R238 to resistor position R165.		Move resistor R238 to resistor position R165.

Anhxco: /* Procedure */

Anhxco — Mon, 12 Sep 2011 13:45:46 GMT

Procedure

← Older revision		Revision as of 13:45, 12 September 2011
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	[[Image:Step_1a.jpg]]		[[Image:Step_1a.jpg]]
-

	'''Step 2'''		'''Step 2'''
-
-	~~'''This is the step I got caught, picture shown in the Japanese article is different from the layout on my LS PCB, and the LS failed to power up (keep beeping) the first time without this change.'''~~
-
-	~~Work area is to right next to oscillator X3 installed at Step 1.~~
-
-	~~The original article is to move R237 to R249, where R237 exist but not R249 in my LS motherboard.Instead I moved R237 to R183.~~
-
-	Solder jumper wire (item 4 in parts list) connecting Pin 3 on X2 (25M oscillator module) to Pin 3 on X4 (Nothing was soldered, only just the solder pad). This step is not in the original Japanese article, change I have to make by educated guess to make the LS power up.
-
-
-	~~[[Image:Step_2a.jpg]]~~
-
-
-	~~'''Step 3'''~~
-
-	~~Work area is to left of ARM CPU, be careful as Resistor label is not next to physical location.~~
-
-	~~Move R50 to R78.~~
-
-
-	~~[[Image:Step_3a.jpg]]~~
-
-
-	~~'''Step 4'''~~

	Work area is on other side of the PCB behind the ARM CPU.		Work area is on other side of the PCB behind the ARM CPU.
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-	'''Step 5'''	+	'''Step 3'''

	Work area is on other side of PCB where X3 oscillator module was added in step 1.		Work area is on other side of PCB where X3 oscillator module was added in step 1.
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	[[Image:Step_5a.jpg]]		[[Image:Step_5a.jpg]]
-

	=='''Finish & Test'''==		=='''Finish & Test'''==

Dommer: /* Test */

Dommer — Sat, 01 Nov 2008 08:38:54 GMT

Test

← Older revision		Revision as of 08:38, 1 November 2008
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	[[Image:top.jpg]]		[[Image:top.jpg]]

-	Update (~~22nd March~~, 2008) My LS has been up and running ~~continuously for~~ the last ~~2 weeks~~ without missing a beat since I have ~~overcloced~~ it.	+	Update (Nov, 2008) My overclocked LS has been up and running 24 x 7 over the last 6 months without missing a beat since I have overclocked it to 500Mhz.

Dommer at 11:09, 22 March 2008

Dommer — Sat, 22 Mar 2008 11:09:46 GMT

← Older revision		Revision as of 11:09, 22 March 2008
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	[[Image:top.jpg]]		[[Image:top.jpg]]
		+
		+	Update (22nd March, 2008) My LS has been up and running continuously for the last 2 weeks without missing a beat since I have overcloced it.

Dommer at 11:07, 22 March 2008

Dommer — Sat, 22 Mar 2008 11:07:45 GMT

← Older revision		Revision as of 11:07, 22 March 2008
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	ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.		ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.
		+
		+
		+	hdparm -tT /dev/sda
		+
		+	/dev/sda:
		+	Timing cached reads: 370 MB in 2.01 seconds = 184.19 MB/sec
		+	Timing buffered disk reads: 114 MB in 3.03 seconds = 37.57 MB/sec
		+
		+	hdparm -tT /dev/sdb
		+
		+	/dev/sdb:
		+	Timing cached reads: 378 MB in 2.00 seconds = 189.14 MB/sec
		+	Timing buffered disk reads: 128 MB in 3.02 seconds = 42.41 MB/sec
		+

	Like all over clocking, the biggest challenge is cooling the CPU to allow stable operation, I have decided to add a heat sink to the CPU. The type I used is similar to the type used in Mother Board or VGA cars for cooling the chip set. Please make sure the height of the heat sink is low enough not to hit the hard disk when installed. I glued the heat sink to the ARM CPU by using Arctic Silver Thermal Adhesive.		Like all over clocking, the biggest challenge is cooling the CPU to allow stable operation, I have decided to add a heat sink to the CPU. The type I used is similar to the type used in Mother Board or VGA cars for cooling the chip set. Please make sure the height of the heat sink is low enough not to hit the hard disk when installed. I glued the heat sink to the ARM CPU by using Arctic Silver Thermal Adhesive.

Ramuk at 22:17, 11 March 2008

Ramuk — Tue, 11 Mar 2008 22:17:03 GMT

← Older revision		Revision as of 22:17, 11 March 2008
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		+	{{Articles\|KuroboxPro\|LSPro\|Hacking}}
	=='''Disclaimer and Preface'''==		=='''Disclaimer and Preface'''==

Dommer at 10:12, 10 March 2008

Dommer — Mon, 10 Mar 2008 10:12:31 GMT

← Older revision		Revision as of 10:12, 10 March 2008
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	ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.		ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.

-	Like all over clocking, the biggest challenge is cooling the CPU to allow stable operation, I have decided to add a heat sink to the CPU. The type I used is similar to the type used in Mother Board or VGA cars for cooling the chip set. ~~The~~ heat sink is glued to the ARM CPU by using Arctic Silver Thermal Adhesive.	+	Like all over clocking, the biggest challenge is cooling the CPU to allow stable operation, I have decided to add a heat sink to the CPU. The type I used is similar to the type used in Mother Board or VGA cars for cooling the chip set. Please make sure the height of the heat sink is low enough not to hit the hard disk when installed. I glued the heat sink to the ARM CPU by using Arctic Silver Thermal Adhesive.

Dommer at 02:53, 10 March 2008

Dommer — Mon, 10 Mar 2008 02:53:28 GMT

← Older revision		Revision as of 02:53, 10 March 2008
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-	The credit goes to the author of the original Japanese article, of which this procedure is based on.	+	The credit goes to the author of the original Japanese article (believe on Kuro and LSProV2 boxes), of which this procedure is based on.

	http://www.google.com/translate?u=http%3A%2F%2Fkurobox.jp%2Fkuroweb%2F&langpair=ja%7Cen&hl=en&ie=UTF8		http://www.google.com/translate?u=http%3A%2F%2Fkurobox.jp%2Fkuroweb%2F&langpair=ja%7Cen&hl=en&ie=UTF8

Dommer at 21:53, 8 March 2008

Dommer — Sat, 08 Mar 2008 21:53:24 GMT

← Older revision		Revision as of 21:53, 8 March 2008
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-	=='''Finish'''==	+	=='''Finish & Test'''==

	Reassemble motherboard back to chassis, re-connect hard disk and assemble case in reverse order of disassemble. You may prefer to test if it works before complete re-assembly of LS. Test with the utmost caution, as any accidental short may brick your box. To confirm if the LS CPU is running at 500MHz, you can SSH into the LS, and by typing "cat /proc/cpuinfo", the BogoMIPS should read 340.78(for 512Mhz CPU clock) instead of 266.24(for 400Mhz CPU clock).		Reassemble motherboard back to chassis, re-connect hard disk and assemble case in reverse order of disassemble. You may prefer to test if it works before complete re-assembly of LS. Test with the utmost caution, as any accidental short may brick your box. To confirm if the LS CPU is running at 500MHz, you can SSH into the LS, and by typing "cat /proc/cpuinfo", the BogoMIPS should read 340.78(for 512Mhz CPU clock) instead of 266.24(for 400Mhz CPU clock).
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	ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.		ftp: 1495778856 bytes received in 39.16Seconds '''38200.50Kbytes/sec'''.

		+	Like all over clocking, the biggest challenge is cooling the CPU to allow stable operation, I have decided to add a heat sink to the CPU. The type I used is similar to the type used in Mother Board or VGA cars for cooling the chip set. The heat sink is glued to the ARM CPU by using Arctic Silver Thermal Adhesive.

-	As ~~the CPU is rated for 400Mhz~~, and I ~~do recommend a heatsink be install~~ to ~~avoid overheat~~ or ~~burning of~~ the CPU~~. Be careful on choosing~~ the ~~height~~ of the heat sink, ~~as it~~ may ~~hit the hard drive~~.	+
		+	[[Image:heat_sink.jpg]]
		+
		+
		+	==Test==
		+
		+	As I am no expert in Linux, and don't know if there is any CPU test or stress utility that I can run on the LS to stress it. In the PC or Window world, the common utility is the Prime number generator test, stressing the CPU to 100% utilization for long time to test if the CPU still operate stable after over clock.
		+
		+	All I did is transfer over 150G of files non-stop over 2 hours, and all works flawlessly. The Top figures, showing the CPU utilization is between 65-70% close to 2 hours. The heat sink is quite warn (or hot) but still touchable. As I have not record the temperature of the CPU before over clock and unable to do a comparison. This 2 hours test is my only test, and may not be scientific. I will let time tell me, and report back in a month or two's time.
		+
		+	[[Image:top.jpg]]